Backplane connector with improved shielding effect

ABSTRACT

A backplane connector includes a wafer and a mounting block. The wafer includes a number of conductive terminals, an insulating frame, a first metal shield and a second metal shield. The conductive terminal includes a contact portion, a tail portion and a connection portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The first metal shield includes a first protruding piece. The second metal shield includes a second protruding piece. The mounting block includes a slot for passing through the tail portions of the differential signal terminals. The first protruding piece and the second protruding piece are at least partially inserted into the slot. This arrangement can provide better shielding adjacent to the tail portions of the differential signal terminals, reduce crosstalk, and improve the quality of signal transmission.

CROSS-REFERENCE TO RELATED APPLICATIONS

This patent application claims priority of a Chinese Patent ApplicationNo. 202010567796.4, filed on Jun. 19, 2020 and titled “BACKPLANECONNECTOR ASSEMBLY”, and a Chinese Patent Application No.202021462798.9, filed on Jul. 22, 2020 and titled “BACKPLANE CONNECTOR”,the entire content of which is incorporated herein by reference.

TECHNICAL FIELD

The present disclosure relates to a backplane connector which belongs toa technical field of connectors.

BACKGROUND

Existing backplane connectors usually include an insulating housing anda plurality of wafers assembled to the insulating housing. Each waferincludes an insulating frame, a plurality of conductive terminalsinsert-molded with the insulating frame, and a metal shield mounted toat least one side of the insulating frame. The conductive terminalsusually include multiple pairs of differential signal terminals, a firstground terminal located on one side of each pair of differential signalterminals, and a second ground terminal located on the other side ofeach pair of differential signal terminals. The first ground terminal,the second ground terminal and the metal shield provide shielding forthe differential signal terminals in order to reduce signal crosstalkand improve the quality of signal transmission.

However, with the continuous improvement of the signal transmissionrequirements of high-speed connectors, there is still room forimprovement in the shielding of the differential signal terminals of theexisting backplane connectors.

SUMMARY

An object of the present disclosure is to provide a backplane connectorwith improved shielding effect.

In order to achieve the above object, the present disclosure adopts thefollowing technical solution: a backplane connector, comprising a waferand a mounting block assembled with the wafer, the wafer comprising: aplurality of conductive terminals, each of the conductive terminalscomprising a contact portion, a tail portion and a connection portionconnecting the contact portion and the tail portion, the tail portionextending through the mounting block; an insulating frame fixed with theconnection portions of the conductive terminals, the contact portionsand the tail portions extending beyond the insulating frame; a firstmetal shield located on one side of the insulating frame; and a secondmetal shield located on the other side of the insulating frame; whereinthe conductive terminals comprise differential signal terminals, a firstground terminal and a second ground terminal, and the differentialsignal terminals are located between the first ground terminal and thesecond ground terminal; wherein the first metal shield comprises a firstprotruding piece, and the second metal shield comprises a secondprotruding piece opposite to the first protruding piece; wherein themounting block comprises a first through hole through which the tailportion of the first ground terminal extends, a second through holethrough which the tail portion of the second ground terminal extends,and a slot through which the tail portions of the differential signalterminals extend; and wherein the first protruding piece and the secondprotruding piece are at least partially inserted into the slot, and thetail portions of the differential signal terminals are located betweenthe first protruding piece and the second protruding piece.

Compared with the prior art, the first metal shield and the second metalshield of the present disclosure are respectively provided with afurther extended first protruding piece and a second protruding piece.The tail portions of the differential signal terminals are locatedbetween the first protruding piece and the second protruding piece. Thisarrangement can provide better shielding adjacent to the tail portionsof the differential signal terminals, reduce crosstalk and improve thequality of signal transmission.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a perspective view of a backplane connector assembly inaccordance with an embodiment of the disclosure;

FIG. 2 is a partial perspective exploded view of FIG. 1 ;

FIG. 3 is a further perspective exploded view of FIG. 2 ;

FIG. 4 is a perspective exploded view of FIG. 3 from another angle;

FIG. 5 is a partially exploded perspective view of a backplane connectorwhen it is separated from a first circuit board;

FIG. 6 is a partial perspective exploded view of FIG. 5 from anotherangle;

FIG. 7 is a partial perspective exploded view of a wafer of the firstbackplane connector;

FIG. 8 is a partially exploded perspective view of FIG. 7 from anotherangle;

FIG. 9 is a side view of the insulating frame when separated from theconductive terminals;

FIG. 10 is a side view of the first metal shield of the first backplaneconnector;

FIG. 11 is a side view of the second metal shield of the first backplaneconnector;

FIG. 12 is a schematic cross-sectional view taken along the line A′-A′in FIG. 5 ;

FIG. 13 is a partial enlarged view of a frame part C in FIG. 12 ;

FIG. 14 is a schematic cross-sectional view taken along line B′-B′ inFIG. 5 ;

FIG. 15 is a partial enlarged view of a frame part D in FIG. 14 ;

FIG. 16 is a bottom view of a second backplane connector;

FIG. 17 is partial enlarged view of a frame part A in FIG. 16 ;

FIG. 18 is a partially exploded perspective view of the second backplaneconnector, in which a mounting block is separated;

FIG. 19 is a partially exploded perspective view of the second backplaneconnector, in which a spacer is separated;

FIG. 20 is a partial enlarged view of a circled part E in FIG. 19 ;

FIG. 21 is another partial perspective exploded view of the secondbackplane connector, in which the mounting block is separated;

FIG. 22 is a partial enlarged view of a circled part F in FIG. 21 ;

FIG. 23 is a partially exploded perspective view of a wafer of thesecond backplane connector;

FIG. 24 is a perspective exploded view of an insulating block and ametal shell;

FIG. 25 is a partial enlarged view of a circled part G in FIG. 23 ;

FIG. 26 is a partial enlarged view of a circled part H in FIG. 23 ;

FIG. 27 is a side view of a first metal shield of the second backplaneconnector;

FIG. 28 is a side view of a second metal shield of the second backplaneconnector;

FIG. 29 is a plan view of a wafer of the second backplane connector whenan insulating block and a metal shell are separated therefrom;

FIG. 30 is a partial perspective cross-sectional view taken along lineC′-C′ in FIG. 2 ; and

FIG. 31 is a partial enlarged view of a frame part I in FIG. 30 .

DETAILED DESCRIPTION

Exemplary embodiments will be described in detail here, examples ofwhich are shown in drawings. When referring to the drawings below,unless otherwise indicated, same numerals in different drawingsrepresent the same or similar elements. The examples described in thefollowing exemplary embodiments do not represent all embodimentsconsistent with this application. Rather, they are merely examples ofdevices and methods consistent with some aspects of the application asdetailed in the appended claims.

The terminology used in this application is only for the purpose ofdescribing particular embodiments, and is not intended to limit thisapplication. The singular forms “a”, “said”, and “the” used in thisapplication and the appended claims are also intended to include pluralforms unless the context clearly indicates other meanings.

It should be understood that the terms “first”, “second” and similarwords used in the specification and claims of this application do notrepresent any order, quantity or importance, but are only used todistinguish different components. Similarly, “an” or “a” and othersimilar words do not mean a quantity limit, but mean that there is atleast one; “multiple” or “a plurality of” means two or more than two.Unless otherwise noted, “front”, “rear”, “lower” and/or “upper” andsimilar words are for ease of description only and are not limited toone location or one spatial orientation. Similar words such as “include”or “comprise” mean that elements or objects appear before “include” or“comprise” cover elements or objects listed after “include” or“comprise” and their equivalents, and do not exclude other elements orobjects. The term “a plurality of” mentioned in the present disclosureincludes two or more.

Hereinafter, some embodiments of the present disclosure will bedescribed in detail with reference to the accompanying drawings. In thecase of no conflict, the following embodiments and features in theembodiments can be combined with each other.

Referring to FIGS. 1 and 2 , an embodiment of the present disclosurediscloses a backplane connector assembly which includes a firstbackplane connector 100, a second backplane connector 200 for matingwith the first backplane connector 100, a first circuit board 301mounted with the first backplane connector 100, and a second circuitboard 302 mounted with the second backplane connector 200. In theillustrated embodiment of the present disclosure, the first backplaneconnector 100 and the second backplane connector 200 are mated in anorthogonal manner. The first circuit board 301 is perpendicular to thesecond circuit board 302.

Referring to FIGS. 3 and 4 , the first backplane connector 100 includesa header 1, a plurality of wafers 2 assembled to the header 1, a spacer3 fixed at a rear end of the plurality of wafers 2, and a mounting block4 mounted at a bottom end of the plurality of wafers 2.

Referring to FIGS. 5 and 6 , in an embodiment of the present disclosure,the header 1 is made of insulating material. The header 1 includes abody portion 11, a first wall portion 12 extending rearwardly from oneside of the body portion 11, and a second wall portion 13 extendingrearwardly from the other side of the body portion 11. The first wallportion 12 and the second wall portion 13 are in parallel. The bodyportion 11 includes a mating surface 111 and a plurality of terminalreceiving grooves 112 extending through the mating surface 111. As shownin FIGS. 7 and 8 , in the illustrated embodiment of the presentdisclosure, the terminal receiving grooves 112 are disposed in multiplerows along a left-right direction, wherein two adjacent rows of terminalreceiving grooves 112 are staggered in a vertical direction. That is, intwo adjacent rows of terminal receiving grooves 112, the terminalreceiving grooves 112 at corresponding positions are not in alignment inthe left-right direction. The first wall portion 12 includes a pluralityof first slots 121 and a plurality of first locking grooves 122communicating with corresponding first slots 121. The second wallportion 13 includes a plurality of second slots 131 and a plurality ofsecond locking grooves 132 communicating with corresponding second slots131. The first locking grooves 122 and the second locking grooves 132extend outwardly along the vertical direction through the first wallportion 12 and the second wall portion 13, respectively. The firstlocking grooves 122 and the second locking grooves 132 are adapted tolock with the wafers 2 in order to prevent the wafers 2 from beingseparated from the header 1. The first slot 121, the second slot 131 andthe terminal receiving grooves 112 which are in alignment with eachother along the vertical direction are used to receive the same wafer 2.

Besides, referring to FIG. 6 , the header 1 also includes a plurality ofpositioning protrusions 14 extending forwardly from the first wallportion 12 and the second wall portion 13, respectively. The positioningprotrusions 14 protrude beyond the mating surface 111. Each positioningprotrusion 14 includes a guiding inclined surface 141 formed at an endthereof.

Referring to FIGS. 7 to 9 , the wafer 2 includes an insulating frame 21,a plurality of conductive terminals 22 fixed to the insulating frame 21,a first metal shield 23 fixed on one side of the insulating frame 21,and a second metal shield 24 fixed on the other side of the insulatingframe 21.

Referring to FIG. 9 , each insulating frame 21 is roughly frame-shapedand includes a rear wall 211, a front wall 212 opposite to the rear wall211, a top wall 213 connecting one end of the rear wall 211 and one endof the front wall 212, a bottom wall 214 connecting the other end of therear wall 211 and the other end of the front wall 212, and a pluralityof connecting walls 215. The connecting walls 215 are capable ofenhancing the structural strength of the frame. The rear wall 211includes a first protrusion 2111 and a second protrusion 2112 whichprotrude rearwardly. The first protrusion 2111 and the second protrusion2112 are spaced apart from each other along the vertical direction. Thefirst protrusion 2111 and the second protrusion 2112 are in alignmentwith each other along the vertical direction. The first protrusion 2111includes a first constriction portion 2113, and the second protrusion2112 includes a second constriction portion 2114. In the illustratedembodiment of the present disclosure, the insulating frame 21 includes ahollow portion 210. The connecting walls 215 include a first connectingwall 2151 connecting the top wall 213 and the bottom wall 214, and asecond connecting wall 2152 connecting the rear wall 211 and the bottomwall 214. The first connecting wall 2151 and the second connecting wall2152 are exposed in the hollow portion 210. The top wall 213 includes afirst locking protrusion 2131 for being inserted into the first lockinggroove 122. The bottom wall 214 includes a second locking protrusion2141 for being inserted into the second locking groove 132.

Referring to FIGS. 7 to 9 , the insulating frame 21 further includes aplurality of posts 216 for fixing the first metal shield 23 and thesecond metal shield 24. In the illustrated embodiment of the presentdisclosure, the posts 216 are disposed on the bottom wall 214, the firstconnecting wall 2151, the second connecting wall 2152 and the front wall212. The first metal shield 23 and the second metal shield 24 arelocated on opposite sides of the insulating frame 21, respectively. Theposts 216 include a plurality of first posts 2161 and a plurality ofsecond posts 2162. The first posts 2161 and the second posts 2162 arelocated on opposite sides of the insulating frame 21, respectively, soas to be fixed and positioned with the first metal shield 23 and thesecond metal shield 24.

Referring to FIG. 9 , each conductive terminal 22 includes a contactportion 221, a tail portion 222 and a connection portion 223 connectingthe contact portion 221 and the tail portion 222. Some of the contactportions 221 are used to electrically connect with the second backplaneconnector 200. The tail portions 222 are used for being mounted to thefirst circuit board 301. In the illustrated embodiment of the presentdisclosure, the contact portion 221 is substantially perpendicular tothe tail portion 222. The connection portion 223 is of a curvedconfiguration.

Each group of conductive terminals 22 include a plurality of firstground terminals G1, a plurality of second ground terminals G2, and aplurality of signal terminals S1. In the illustrated embodiment of thepresent disclosure, two adjacent signal terminals S1 form a pair ofdifferential signal terminals. Each pair of differential signalterminals are located between one first ground terminal G1 and onesecond ground terminal G2. That is, each group of conductive terminals22 are arranged in a manner of G1-S1-S1-G2, which is beneficial toimprove the quality of signal transmission. The differential signalterminals are narrow-side coupling or wide-side coupling. A width of thefirst ground terminal G1 and a width the second ground terminal G2 aregreater than a width of each signal terminal S1 which is located betweenthe first ground terminal G1 and the second ground terminal G2.Therefore, it is beneficial to increase the shielding area and improvethe shielding effect.

In the illustrated embodiment of the present disclosure, the connectionportions 223 of the conductive terminals 22 are partially insert-moldedwith the insulating frame 21. Each connection portion 223 of the signalterminal S1 has a narrowed portion 2230 insert-molded with theinsulating frame 21 so as to adjust the impedance of the signal terminalS1 for achieving impedance matching. In the illustrated embodiment ofthe present disclosure, the contact portion 221 of the signal terminalS1 is substantially needle-shaped. The contact portion 221 of the firstground terminal G1 and the contact portion 221 of the second groundterminal G2 are substantially rectangular-shaped. The contact portion221 of the signal terminal S1 and the connection portion 223 of theconductive terminal 22 are both coplanar, which means they are locatedin a same first plane (for example, a horizontal plane). It should benoted that the technical term “coplanar” used in the present disclosureis intended to indicate that related components are substantially flush,which includes situations of incomplete coplanarity caused bymanufacturing tolerances. In the illustrated embodiment of the presentdisclosure, the first ground terminal G1 includes a first torsionportion 2241 connecting its contact portion 221 and its tail portion222, so that the contact portion 221 of the first ground terminal G1 islocated in a second plane (for example, a vertical plane) perpendicularto the first plane. The second ground terminal G2 includes a secondtorsion portion 2242 connecting its contact portion 221 and its tailportion 222, so that the contact portion 221 of the second groundterminal G2 is also located in the second plane (for example, thevertical plane) perpendicular to the first plane. The contact portion221 of the first ground terminal G1 and the contact portion 221 of thesecond ground terminal G2 are parallel to each other. Each connectionportion 223 of the first ground terminals G1 and the second groundterminals G2 further includes a slot 2231 adjacent to its correspondingtail portion 222. The slot 2231 extend through a bottom edge of theconnection portion 223, so that the connection portions 223 is dividedinto a first end portion 2232 and a second end portion 2233.

Referring to FIGS. 13 and 15 , in the illustrated embodiment of thepresent disclosure, the contact portion 221 and the connection portion223 of the first ground terminal G1 have a first wide surface 221 a anda first narrow surface 221 b perpendicular to the first wide surface 221a. The contact portion 221 and the connection portion 223 of the secondground terminal G2 have a second wide surface 221 c and a second narrowsurface 221 d perpendicular to the second wide surface 221 c. Theconnection portions 223 of each pair of differential signal terminalsare located between the first narrow surface 221 b of the first groundterminal G1 and the second narrow surface 221 d of the second groundterminal G2 which are located on opposite sides of the connectionportions 223 of each pair of differential signal terminals. The contactportions 221 of each pair of differential signal terminals are locatedbetween the first wide surface 221 a of the first ground terminal G1 andthe second wide surface 221 c of the second ground terminal G2 which arelocated on opposite sides of the contact portions 221 of each pair ofdifferential signal terminals. In the illustrated embodiment of thepresent disclosure, a width of the first wide surface 221 a and a widthof the second wide surface 221 c are greater than a width of eachcontact portion 221 of the signal terminals S1, thereby better shieldingcan be provided for the contact portions 221 of the signal terminals S1.

In the illustrated embodiment of the present disclosure, the first metalshield 23 and the second metal shield 24 are symmetrically disposed onopposite sides of the insulating frame 21. Referring to FIG. 10 , thefirst metal shield 23 includes a first main body portion 231 and a firstextension portion 232 extending from the first main body portion 231.The first main body portion 231 is located on one side of the connectionportions 223 of the conductive terminals 22. The first extension portion232 is located on one side of the contact portions 221 of the conductiveterminals 22. In the illustrated embodiment of the present disclosure,the first extension portion 232 and the first main body portion 231 arelocated in different planes, in which the first extension portion 232 isfarther away from the second metal shield 24 than the first main bodyportion 231. The first main body portion 231 includes a plurality offirst mounting holes 2311 for mating with the plurality of first posts2161. The first posts 2161 are fixed and positioned in the firstmounting holes 2311 by soldering, thereby the fixing and positioning ofthe first metal shield 23 and the insulating frame 21 are realized. Thefirst main body portion 231 includes a plurality of ribs 233. The ribs233 include a plurality of first ribs 2331 protruding toward the firstground terminals G1 and a plurality of second ribs 2332 protrudingtoward the second ground terminals G2. The first ribs 2331 correspondingto the first ground terminal G1 are disposed along an extendingdirection of the connection portion 223 of the first ground terminal G1.The second ribs 2332 corresponding to the second ground terminal G2 aredisposed along an extending direction of the connection portion 223 ofthe second ground terminal G2. In the illustrated embodiment of thepresent disclosure, the first ribs 2331 and the second ribs 2332 areformed by stamping the first main body portion 231. The first ribs 2331and the second ribs 2332 protrude toward the second metal shield 24. Thefirst ribs 2331 and the second ribs 2332 are discontinuously disposedalong the extending direction of the connection portion 223 of the firstground terminal G1 and the extending direction of the connection portion223 of the second ground terminal G2, respectively, so as to achievemulti-position contact. In order to improve the reliability of thecontact between the first metal shield 23 and the first ground terminalsG1 and the second ground terminals G2. In the illustrated embodiment ofthe present disclosure, referring to FIG. 13 , a wall thickness of thefirst rib 2331, a wall thickness of the second rib 2332, and a wallthickness of a portion of the first main body portion 231 locatedbetween the first rib 2331 and the second rib 2332 are the same.

The first extension portion 232 includes a plurality of first bulges2321 protruding toward the corresponding contact portions 221 of thefirst ground terminals G1, a plurality of second bulges 2322 protrudingtoward the corresponding contact portions 221 of the second groundterminals G2, and a plurality of first elastic pieces 2323 each of whichis located between adjacent first bulge 2321 and second bulge 2322. Thefirst elastic pieces 2323 extend along directions toward the first mainbody portion 231. Each first elastic piece 2323 has an arc-shapedcontact portion 2324. In the illustrated embodiment of the presentdisclosure, the first extension portion 232 further includes two firstprotruding tabs 2325 located at opposite sides of each first elasticpiece 2323. The first protruding tabs 2325 and the first elastic pieces2323 extend along opposite directions. The first protruding tabs 2325protrude sidewardly to contact the adjacent wafer 2 so as to improve theshielding effect. In the illustrated embodiment of the presentdisclosure, referring to FIG. 15 , a wall thickness of the first bulge2321, a wall thickness of the second bulge 2322 and a wall thickness ofa portion of the first extension portion 232 located between the firstbulge 2321 and the second bulge 2322 are the same.

In addition, the first main body portion 231 further includes aplurality of first protruding pieces 2312 extending downwardly from abottom edge thereof and a plurality of connecting pieces 2313 each ofwhich is located between two adjacent first protruding pieces 2312. Byproviding the first protruding pieces 2312, the shielding length can beextended, and the shielding effect of the signal terminals S1 can beimproved. In the illustrated embodiment of the present disclosure, theconnecting pieces 2313 are stamped from the first main body portion 231.Each connecting piece 2313 straddles the corresponding slot 2231 toconnect one side of the first end portion 2232 and the second endportion 2233 of the same first ground terminal G1, thereby improving theshielding effect. At the same time, each connecting piece 2313 can alsoconnect one side of the first end portion 2232 and the second endportion 2233 of the same second ground terminal G2, thereby improvingthe shielding effect.

Similarly, referring to FIG. 11 , the second metal shield 24 includes asecond main body portion 241 and a second extension portion 242extending from the second main body portion 241. The second main bodyportion 241 is located on the other side of the connection portions 223of the conductive terminals 22. The second extension portion 242 islocated on the other side of the contact portions 221 of the conductiveterminals 22. In the illustrated embodiment of the present disclosure,the second extension portion 242 and the second main body portion 241are located in different planes, in which the second extension portion242 is farther away from the first metal shield 23 than the second mainbody portion 241. The second main body portion 241 includes a pluralityof second mounting holes 2411 for mating with the plurality of secondposts 2162. The second posts 2162 are fixed and positioned in the secondmounting holes 2411 by soldering, so as to realize the fixing andpositioning of the second metal shield 24 and the insulating frame 21.The second main body portion 241 includes a plurality of ribs 243. Theribs 243 include a plurality of third ribs 2431 protruding toward thefirst ground terminals G1 and a plurality of fourth ribs 2432 protrudingtoward the second ground terminals G2. The third ribs 2431 are disposedalong the extending direction of the connection portion 223 of the firstground terminal G1. The fourth ribs 2432 are disposed along theextending direction of the connection portion 223 of the second groundterminal G2. In the illustrated embodiment of the present disclosure,the third ribs 2431 and the fourth ribs 2432 are formed by stamping thesecond main body portion 241. The third ribs 2431 and the fourth ribs2432 protrude toward the first metal shield 23. The third ribs 2431 andthe fourth ribs 2432 are discontinuously disposed along the extendingdirection of the connection portion 223 of the first ground terminal G1and the extending direction of the connection portion 223 of the secondground terminal G2, respectively, so as to achieve multi-positioncontact. As a result, the reliability of the contact between the secondmetal shield 24 and the first ground terminals G1 and the second groundterminals G2 is improved. In the illustrated embodiment of the presentdisclosure, a wall thickness of the third rib 2431, a wall thickness ofthe fourth rib 2432 and a wall thickness of a portion of the second mainbody portion 241 located between the third rib 2431 and the fourth rib2432 are the same. In an embodiment of the present disclosure, solderingis performed on the surfaces of the ribs 233 and the ribs 243 to solderthe ribs 233 and the ribs 243 to the first ground terminals G1 and thesecond ground terminals G2. For example, soldering is performed on thesurfaces of the first ribs 2331, the second ribs 2332, the third ribs2431 and the fourth ribs 2432 in order to solder the first ribs 2331,the second ribs 2332, the third ribs 2431 and the fourth rib 2432 to thefirst ground terminals G1 and the second ground terminals G2. Thesoldering method is at least one of spot soldering, laser soldering andultrasonic soldering.

The second extension portion 242 includes a plurality of third bulges2421 protruding toward the contact portions 221 of the first groundterminals G1, a plurality of fourth bulges 2422 protruding toward thecontact portions 221 of the second ground terminals G2, and a pluralityof second elastic pieces 2423 each of which is located between adjacentthird bulge 2421 and fourth bulge 2422. The second elastic pieces 2423extend along directions toward the second main body portion 241. Eachsecond elastic piece 2423 has an arc-shaped contact portion 2424. In theillustrated embodiment of the present disclosure, the second extensionportion 242 further includes two second protruding tabs 2425 located atopposite sides of each second elastic piece 2423. The second protrudingtabs 2425 and the second elastic pieces 2423 extend along oppositedirections. The second protruding tabs 2425 protrude sidewardly tocontact the adjacent wafer 2 so as to improve the shielding effect. Inthe illustrated embodiment of the present disclosure, a wall thicknessof the third bulge 2421, a wall thickness of the fourth bulge 2422, anda wall thickness of a portion of the second extension portion 242located between the third bulge 2421 and the fourth bulge 2422 are thesame.

In addition, the second main body portion 241 further includes aplurality of second protruding pieces 2412 extending downwardly from abottom edge thereof, and a plurality of connecting pieces 2413 each ofwhich is located between two adjacent second protruding pieces 2412. Byproviding the second protruding pieces 2412, the shielding length can beextended, and the shielding effect on the signal terminals S1 can beimproved. In the illustrated embodiment of the present disclosure, theconnecting pieces 2413 are stamped from the second main body portion241, and the connecting piece 2413 straddles the corresponding slot 2231so as to connect the other side of the first end portion 2232 and thesecond end portion 2233 of the same first ground terminal G1 so as toimprove the shielding effect. At the same time, the connecting piece2413 can also connect the other side of the first end portion 2232 andthe second end portion 2233 of the same second ground terminal G2 so asto improve the shielding effect.

Referring to FIG. 13 , along a length of the connection portion 223 ofthe conductive terminal 22, the first rib 2331 of the first metal shield23 and the third rib 2431 of the second metal shield 24 respectivelycontact two opposite sides of the connection portion 223 of the firstground terminal G1, and the second rib 2332 of the first metal shield 23and the fourth rib 2432 of the second metal shield 24 respectivelycontact two opposite sides of the connection portion 223 of the secondground terminal G2, thereby forming a shielding cavity 26 surroundingthe outer periphery of the connection portions 223 of each pair ofdifferential signal terminals. In the illustrated embodiment of thepresent disclosure, the first rib 2331 and the third rib 2431respectively contact the first wide surface 221 a of the connectionportion 223 of the first ground terminal G1. The second rib 2332 and thefourth rib 2432 respectively contact the second wide surface 221 c ofthe connection portion 223 of the second ground terminal G2. In theillustrated embodiment of the present disclosure, the shielding cavity26 is jointly formed by the first main body portion 231, the second mainbody portion 241, the first ground terminal G1 and the second groundterminal G2. The connection portion 223 of the first ground terminal G1includes a first tab portion 2234 protruding into the shielding cavity26. The connection portion 223 of the second ground terminal G2 includesa second tab portion 2235 protruding into the shielding cavity 26. Theconnection portions 223 of the differential signal terminals are locatedbetween the first tab portion 2234 and the second tab portion 2235. Inthe illustrated embodiment of the present disclosure, there are aplurality of the shielding cavities 26 which are disposed along anarrangement direction of each group of the conductive terminals 22. Twoadjacent shielding cavities 26 share a single first ground terminal G1or a single second ground terminal G2. In addition, a part of the sharedfirst ground terminal G1 protrudes into one shielding cavity 26, andanother part of the shared first ground terminal G1 protrudes intoanother shielding cavity 26.

Referring to FIG. 15 , in the length of the contact portion 221 of theconductive terminal 22, the first bulge 2321 of the first metal shield23 and the third bulge 2421 of the second metal shield 24 respectivelycontact two opposite side surfaces of the contact portion 221 of thefirst ground terminal G1, and the second bulge 2322 of the first metalshield 23 and the fourth bulge 2422 of the second metal shield 24respectively contact two opposite side surfaces of the contact portion221 of the second ground terminal G2. In the illustrated embodiment ofthe present disclosure, the first bulge 2321 of the first metal shield23 and the third bulge 2421 of the second metal shield 24 respectivelycontact the first narrow surfaces 221 b of the contact portion 221 ofthe first ground terminal G1. The second bulge 2322 of the first metalshield 23 and the fourth bulge 2422 of the second metal shield 24respectively contact the second narrow surfaces 221 d of the contactportion 221 of the second ground terminal G2. The first extensionportion 232, the second extension portion 242, the first ground terminalG1 and the second ground terminal G2 jointly form a shielding space 27for accommodating the corresponding contact portions 221 of thedifferential signal terminals. The first elastic piece 2323 and thesecond elastic piece 2423 extend into the shielding space 27. In theillustrated embodiment of the present disclosure, there are multipleshielding spaces 27 which are disposed along a stacking direction ofeach group of the conductive terminals 22. Two adjacent shielding spaces27 share a single first ground terminal G1 or a single second groundterminal G2. One first wide surface 221 a of the contact portion 221 ofthe shared first ground terminal G1 is exposed to the shielding space27, and the other first wide surface 221 a of the contact portion 221 ofthe shared first ground terminal G1 is exposed to an adjacent shieldingspace 27. Similarly, a first wide surface 221 c of the contact portion221 of the shared second ground terminal G2 is exposed to the adjacentshielding space 27, and the other wide surface 221 c of the contactportion 221 of the shared second ground terminal G2 is exposed toanother adjacent shielding space 27.

In the illustrated embodiment of the present disclosure, there aremultiple wafers 2 of the first backplane connector 100, and the terminalarrangement of two adjacent wafers 2 are staggered. Correspondingly, theshielding cavities 26 at the same position of two adjacent wafers 2 arestaggered (referring to FIG. 12 ), and the shielding spaces 27 at thesame position of two adjacent wafers 2 are staggered (referring to FIG.14 ).

Referring to FIGS. 16 and 17 , the mounting block 4 includes a pluralityof first through holes 41 for allowing the tail portions 222 of thefirst ground terminals G1 to pass through, a plurality of second throughholes 42 for allowing the tail portions 222 of the second groundterminals G2 to pass through, and a plurality of slots 43 for allowingthe tail portions 222 of the signal terminals S1 to pass through. For agroup of conductive terminals 22 arranged in the manner of G1-S1-S1-G2,the first through holes 41 and the second through holes 42 are locatedon opposite sides of the slot 43 and are in communication with the slot43. A width of the slot 43 is greater than either a width of the firstthrough hole 41 or a width of the second through hole 42, so that thetail portions 222 of the differential signal terminals can be completelyexposed in the slot 43. The mounting block 4 further includes a firstabutting surface 431 located on one side of the slot 43 and a secondabutting surface 432 located on the other side of the slot 43. The firstabutting surface 431 and the second abutting surface 432 are disposedopposite to each other. Both the first protruding pieces 2312 of thefirst metal shield 23 and the second protruding pieces 2412 of thesecond metal shield 24 are at least partially inserted into the slots43. In the illustrated embodiment of the present disclosure, the firstprotruding piece 2312 of the first metal shield 23 abuts against thefirst abutting surface 431. The second protruding piece 2412 of thesecond metal shield 24 abuts against the second abutting surface 432.Along an arrangement direction of a group of conductive terminals 22which are arranged in the manner of G1-S1-S1-G2, the tail portions 222of the differential signal terminals are located between the tailportion 222 of the first ground terminal G1 and the tail portion 222 ofthe second ground terminal G2. Along a direction perpendicular to thearrangement direction, the tail portions 222 of the differential signalterminals are located between the first protruding piece 2312 of thefirst metal shield 23 and the second protruding piece 2412 of the secondmetal shield 24. This arrangement improves the shielding effect of thedifferential signal terminals. Preferably, the mounting block 4 iselectroplated plastic which can further improve the shielding effect.

Referring to FIG. 18 , the mounting block 4 further includes a firstmounting wall 44 and a plurality of first side walls 45 perpendicular tothe first mounting wall 44. The plurality of first side walls 45 arespaced apart and parallel to each other. A plurality of first slots 40for insertion of the wafers 2 are formed between each two adjacent firstside walls 45. A top of the first side wall 45 includes an inclinedsurface 451 communicating with the first slot 40 and acting as aninsertion guide. The inclined surfaces 451 of the two first side walls45 located on opposite sides of the first slot 40 have differentinclination directions so as to form a bell-mouth opening. Thebell-mouth opening is adapted to facilitate the insertion of the wafers2 or to facilitate to mount the mounting block 4 to the wafers 2. Aninner side of the first side wall 45 also includes a plurality ofpositioning grooves 452 communicating with the first slot 40 and usedfor positioning the first post 2161 and the second post 2162 which arelocated on the bottom wall 214 of the insulating frame 21.

Referring to FIGS. 3 and 4 , the second backplane connector 200 includesa header 5, a plurality of wafers 6 assembled to the header 5, a spacer7 holding on one side of the plurality of wafers 6, and a mounting block8 holding the other side of the plurality of wafers 6.

The header 5 is made of insulating material. The header 5 includes abody portion 51, a wall portion 52 extending from the body portion 51 toone end, and a frame portion 53 extending from the body portion 51 tothe other end. The body portion 51 includes a plurality of terminalreceiving grooves 511 extending forwardly and rearwardly. In theillustrated embodiment of the present disclosure, the terminal receivinggrooves 511 are disposed in multiple rows along a left-right direction.Two adjacent rows of terminal receiving grooves 511 are staggered in avertical direction. That is, in two adjacent rows of the terminalreceiving grooves 511, the terminal receiving grooves 511 atcorresponding positions are not in alignment with each other in theleft-right direction. The wall portion 52 includes a first wall portion521 and a second wall portion 522 disposed opposite to each other. Thefirst wall portion 521 includes a plurality of first slots 5211. Thesecond wall portion 522 includes a plurality of second slots 5221. Thefirst slot 5211 and the second slot 5221, which are in alignment witheach other along the vertical direction, together with the secondterminal receiving slot 511 corresponding to the first slot 5211 and thesecond slot 5221 are jointly used for receiving the same wafer 6.

The frame portion 53 includes a first extension wall 531, a secondextension wall 532 opposite to the first extension wall 531, a top wall533 connecting one end of the first extension wall 531 and one end ofthe second extension wall 532, a bottom wall 534 connecting the otherend of the first extension wall 531 and the other end of the secondextension wall 532, and a receiving space 535 jointly enclosed by thefirst extension wall 531, the second extension wall 532, the top wall533 and the bottom wall 534. The receiving space 535 is used for atleast partially accommodating the first backplane connector 100.Specifically, in the illustrated embodiment of the present disclosure,both the first extension wall 531 and the second extension wall 532include a plurality of positioning grooves 530 disposed at intervals.The receiving space 535 is used for accommodating the header 1. Thepositioning grooves 530 are used for accommodating the correspondingpositioning protrusions 14 so as to improve the mating accuracy of thefirst backplane connector 100 and the second backplane connector 200.

Referring to FIG. 23 , each wafer 6 includes an insulating frame 61, aplurality of conductive terminals 62 insert-molded with the insulatingframe 61, a first metal shield 63 fixed on one side of the insulatingframe 61, and a second metal shield 64 fixed on the other side of theinsulating frame 61.

Referring to FIGS. 23 and 29 , the insulating frame 61 is roughlyframe-shaped. The insulating frame 61 includes a rear wall 611, a frontwall 612 opposite to the rear wall 611, a top wall 613 connecting oneend of the rear wall 611 and one end of the front wall 612, a bottomwall 614 connecting the other end of the rear wall 611 and the other endof the front wall 612, and a plurality of connecting walls 615. Theconnecting walls 615 can enhance the structural strength of the frame.The rear wall 611 includes a first protrusion 6111. The first protrusion6111 includes a first constriction portion 6113. In the illustratedembodiment of the present disclosure, the insulating frame 61 includes ahollow portion 610. The connecting walls 615 include a first connectingwall 6151 connecting the top wall 613 and the bottom wall 614, and asecond connecting wall 6152 connecting the rear wall 611 and the bottomwall 614. The first connecting wall 6151 and the second connecting wall6152 are exposed in the hollow portion 610.

The front wall 612 includes a plurality of protruding blocks 6121disposed at intervals and a groove 6122 located between two adjacentprotruding blocks 6121. The protruding block 6121 includes an opening6123 to partially expose corresponding conductive terminal 62 in orderto adjust the impedance.

The insulating frame 61 further includes a plurality of posts 616 forfixing and positioning the first metal shield 63 and the second metalshield 64. In the illustrated embodiment of the present disclosure, theposts 616 are disposed on the bottom wall 614, the first connecting wall6151 and the second connecting wall 6152. The first metal shield 63 andthe second metal shield 64 are located on two sides of the insulatingframe 61, respectively. The posts 616 include a plurality of first posts6161 and a plurality of second posts 6162. The first posts 6161 and thesecond posts 6162 are located on opposite sides of the insulating frame61 so to be fixed to the first metal shield 63 and the second metalshield 64, respectively.

Each conductive terminals 62 includes a contact portion 621, tailportion 622, and a connection portion 623 connecting the contact portion621 and the tail portion 622. Some of the contact portions 621 are usedto electrically connect with the first backplane connector 100. The tailportions 622 are used to be mounted to the second circuit board 302. Inthe illustrated embodiment of the present disclosure, the contactportion 621 is substantially perpendicular to the tail portion 622. Theconnection portion 623 is of a curved configuration.

Each group of conductive terminals 62 include a plurality of firstground terminals G1, a plurality of second ground terminals G2, and aplurality of signal terminals S1. In the illustrated embodiment of thepresent disclosure, two adjacent signal terminals S1 form a pair ofdifferential signal terminals. Each pair of differential signalterminals are located between one first ground terminal G1 and onesecond ground terminal G2. That is, each group of conductive terminals62 are disposed in a manner of G1-S1-S1-G2, which is beneficial toimprove the quality of signal transmission. The differential signalterminals are narrow-side coupling or wide-side coupling. A width of thefirst ground terminal G1 and a width of the second ground terminal G2are greater than a width of each signal terminal S1 therebetween, whichis beneficial to increase the shielding area and improve the shieldingeffect.

In the illustrated embodiment of the present disclosure, the connectionportions 623 of the conductive terminals 62 are partially insert-moldedwith the insulating frame 61. The connection portion 623 of the signalterminal S1 includes a narrowed portion 6230 insert-molded with theinsulating frame 61 for adjusting the impedance of the signal terminalS1 in order to achieve impedance matching. Referring to FIG. 25 , in theillustrated embodiment of the present disclosure, each contact portion621 of the signal terminal S1 has a two-half structure, which includes afirst contact section 6211, a second contact section 6212, and a slot6210 located between the first contact section 6211 and the secondcontact section 6212. When the needle-shaped contact portion 221 of thesignal terminal S1 of the first backplane connector 100 is insertedbetween the first contact section 6211 and the second contact section6212, the first contact section 6211 and the second contact section 6212can be elastically deformed in order to improve the contact reliability.The first contact section 6211 includes a first arc-shaped surface, andthe second contact section 6212 includes a second arc-shaped surface.The first arc-shaped surface and the second arc-shaped surface aredisposed opposite to each other so as to jointly form a mating hole 6215for receiving the contact portion 221 of the signal terminal S1 of thefirst backplane connector 100. The two signal terminals S1 constitutinga pair of differential signal terminals, their connection portions 623are disposed in a first direction (for example, a vertical direction),and their contact portions 621 are disposed in a direction (for example,a left-right direction) perpendicular to the first direction.

Each contact portion 621 of the first ground terminal G1 and the secondground terminal G2 is substantially flat. The contact portion 621 of thefirst ground terminal G1, the contact portion 621 of the second groundterminal G2, and the connection portions 623 of the conductive terminals62 are all coplanar. As shown in FIG. 26 , each connection portion 623of the first ground terminal G1 and the second ground terminal G2further includes a slot 6231 adjacent to its corresponding the tailportion 622. The slot 6231 extends through a bottom edge of theconnection portion 623, so that the connection portion 623 is dividedinto a first end portion 6232 and a second end portion 6233. Each of thefirst end portion 6232 and the second end portion 6233 is connected withone tail portion 622. The contact portion 621 of the first groundterminal G1 and the contact portion 621 of the second ground terminal G2both extend into the corresponding grooves 6122 to facilitate contactwith the first metal shield 63 and the second metal shield 64. Thecontact portions 621 of the signal terminals S1 extend beyond theprotruding block 6121.

In the illustrated embodiment of the present disclosure, the contactportion 621 and the connection portion 623 of the first ground terminalG1 both include a first wide surface 621 a and a first narrow surface621 b perpendicular to the first wide surface 621 a. The contact portion621 and the connection portion 623 of the second ground terminal G2 bothinclude a second wide surface 621 c and a second narrow surface 621 dperpendicular to the second wide surface 621 c. The connection portions623 of each pair of differential signal terminals are located betweenthe first narrow surface 621 b of the first ground terminal G1 and thesecond narrow surface 621 d of the second ground terminal G2 which arelocated on opposite sides of the connection portions 623 of each pair ofdifferential signal terminals.

Referring to FIGS. 22 to 24 , each group of wafers 6 further includes aninsulating block 65 sleeved on the contact portions 621, and a metalshell 66 sleeved on the insulating block 65. Each insulating block 65includes two through holes 651 into which the contact portions 621 ofthe signal terminals S1 are inserted, and a mating surface 652 at an endthereof. In the illustrated embodiment of the present disclosure, theinsulating block 65 is substantially cuboid shaped. Correspondingly, themetal shell 66 is substantially cuboid shaped. In an embodiment of thepresent disclosure, the insulating block 65 is fixed in the metal shell66, for example, by assembling.

Referring to FIGS. 22 and 24 , the metal shell 66 includes a first sidewall 661, a second side wall 662, a third side wall 663 and a fourthside wall 664. The first side wall 661 is opposite to the third sidewall 663. The second side wall 662 is opposite to the fourth side wall664. An area of the first side wall 661 and the third side wall 663 islarger than an area of the second side wall 662 and the fourth side wall664. The ends of the first side wall 661, the second side wall 662, thethird side wall 663 and the fourth side wall 664 all include adeflection portion 665 which is bent inwardly. By providing thedeflection portions 665, a constricted portion can be formed at an endof the metal shell 66, so that outer surfaces 6651 of the deflectionportions 665 can guide the wafer 6 to be assembled to the header 5, andeven guide the metal shell 66 to be inserted into the shielding space 27of the first backplane connector 100. In addition, in order to betterrestrict the insulating block 65, the second side wall 662 and thefourth side wall 664 further include restriction protrusions 6621, 6641formed by stamping the second side wall 662 and the fourth side wall 664inwardly. The restriction protrusions 6621, 6641 are used to mate withthe insulating block 65 so as to prevent the insulating block 65 frombeing drawn out of the metal shell 66.

In the illustrated embodiment of the present disclosure, the metal shell66 further includes a first extension piece 6611 extending from thefirst side wall 661 and a pair of first slots 6612 located on oppositesides of the first extension piece 6611. The metal shell 66 furtherincludes a second extension piece 6631 extending from the third sidewall 663 and a pair of second slots 6632 located on opposite sides ofthe second extension piece 6631. The first extension piece 6611 is invertical contact with the contact portion 621 of the first groundterminal G1 so as to improve the shielding effect. The second extensionpiece 6631 is in vertical contact with the contact portion 621 of thesecond ground terminal G2 so as to improve the shielding effect. In theillustrated embodiment of the present disclosure, the first extensionpiece 6611 and the second extension piece 6631 are deflected outwardlyand then extend, so that a distance between the first extension piece6611 and the second extension piece 6631 on the same metal shell 66 isgreater than a distance between the first side wall 661 and the thirdside wall 663. Referring to FIGS. 37 and 38 , for a group of conductiveterminals 62 arranged in the manner of G1-S1-S1-G2, the contact portion621 of the first ground terminal G1 includes a first notch 6216 adjacentto the differential signal terminals. The first notch 6216 is used forreceiving the first extension piece 6611. The contact portion 621 of thesecond ground terminal G2 includes a second notch 6217 adjacent to thedifferential signal terminals. The second notch 6217 is used forreceiving the second extension piece 6631. In the illustrated embodimentof the present disclosure, taking two adjacent pairs of differentialsignal terminals sharing one second ground terminal G2 as an example,two sides of the second ground terminal G2 respectively include secondnotches 6217 facing different differential signal terminals, and thesecond notches 6217 are used for mating with two adjacent metal shells66.

In the illustrated embodiment of the present disclosure, the first metalshield 63 and the second metal shield 64 are symmetrically disposed onboth sides of the insulating frame 61. Referring to FIGS. 36 and 41 ,the first metal shield 63 includes a first main body portion 631, afirst extension portion 632 extending from the first main body portion631, and a first elastic arm 634 and a second elastic arm 635 which arerespectively located on two sides of the first extension portion 632.The first elastic arm 634 and the second elastic arm 635 extend beyondthe first main body portion 631 to contact the first ground terminal G1and the second ground terminal G2, respectively. The first main bodyportion 631 is located on one side of the connection portion 623 of theconductive terminal 62. In the illustrated embodiment of the presentdisclosure, the first extension portion 632 and the first main bodyportion 631 are located in different planes, in which the firstextension portion 632 is farther away from the second metal shield 64than the first main body portion 631. The first main body portion 631includes a plurality of first mounting holes 6311 for mating with theplurality of first posts 6161. The first posts 6161 are fixed to thefirst mounting holes 6311 by soldering. The first main body portion 631includes a plurality of ribs 633. The ribs 633 include a plurality offirst ribs 6331 protruding toward the first ground terminal G1 and aplurality of second ribs 6332 protruding toward the second groundterminal G2. The first ribs 6331 are disposed along an extendingdirection of the connection portion 623 of the first ground terminal G1.The second ribs 6332 are disposed along an extending direction of theconnection portion 623 of the second ground terminal G2. In theillustrated embodiment of the present disclosure, the first ribs 6331and the second ribs 6332 are formed by stamping the first main bodyportion 631. The first ribs 6331 and the second ribs 6332 protrudetoward the second metal shield 64. The first ribs 6331 and the secondribs 6332 are disposed discontinuously along the extending direction ofthe connection portion 623 of the first ground terminal G1 and theextending direction of the connection portion 623 of the second groundterminal G2, respectively, so as to achieve multi-position contact.Therefore, the reliability of the contact between the first metal shield63 and the first ground terminals G1 and the second ground terminals G2is improved. In the illustrated embodiment of the present disclosure, awall thickness of the first rib 6331, a wall thickness of the second rib6332, and a wall thickness of a portion of the first main body portion631 located between the first rib 6331 and the second rib 6332 are thesame.

In addition, the first main body portion 631 further includes aplurality of first protruding pieces 6312 extending downwardly from abottom edge thereof and a plurality of connecting pieces 6313 each ofwhich is located between two adjacent first protruding pieces 6312. Byproviding the first protruding pieces 6312, the shielding length can beextended, and the shielding effect on the signal terminals S1 can beimproved. In the illustrated embodiment of the present disclosure, theconnecting pieces 6313 are stamped from the first main body portion 631.The connecting piece 6313 straddles the corresponding slot 6231 toconnect one side of the first end portion 6232 and the second endportion 6233 of the same first ground terminal G1, thereby improving theshielding effect. At the same time, the connecting piece 6313 can alsoconnect one side of the first end portion 6232 and the second endportion 6233 of the same second ground terminal G2, thereby improvingthe shielding effect.

In the illustrated embodiment of the present disclosure, there aremultiple first extension portions 632 which are disposed at intervals.The third extensions 632 are used to be inserted into the first slots6612 and the second slots 6632 of the metal shell 66 to achieve contactand improve the shielding effect.

Similarly, referring to FIG. 28 , the second metal shield 64 includes asecond main body portion 641, a second extension portion 642 extendingfrom the second main body portion 641, and a third elastic arm 644 and afourth elastic arm 645 which are respectively located on both sides ofthe second extension portion 642. The third elastic arm 644 and thefourth elastic arm 645 extend beyond the second main body portion 641 tocontact the first ground terminal G1 and the second ground terminal G2,respectively. The second main body portion 641 is located on the otherside of the connection portion 623 of the conductive terminal 62. In theillustrated embodiment of the present disclosure, the second extensionportion 642 and the second main body portion 641 are located indifferent planes, in which the second extension portion 642 is fartheraway from the first metal shield 63 than the second main body portion641. The second main body portion 641 includes a plurality of secondmounting holes 6411 for mating with the plurality of second posts 6162.The second posts 6162 are fixed and positioned in the second mountingholes 6411 by soldering. The second main body portion 641 includes aplurality of ribs 643. The ribs 643 include a plurality of third ribs6431 protruding toward the first ground terminal G1 and a plurality offourth ribs 6432 protruding toward the second ground terminal G2. Thethird ribs 6431 are disposed along the extending direction of theconnection portion 623 of the first ground terminal G1. The fourth ribs6432 are disposed along the extending direction of the connectionportion 623 of the second ground terminal G2. In the illustratedembodiment of the present disclosure, the third ribs 6431 and the fourthribs 6432 are formed by stamping the second main body portion 641. Thethird ribs 6431 and the fourth ribs 6432 protrude toward the first metalshield 63. The third ribs 6431 and the fourth ribs 6432 are disposeddiscontinuously along the extending direction of the connection portion623 of the first ground terminal G1 and the extending direction of theconnection portion 623 of the second ground terminal G2, respectively,so as to achieve multi-position contact. Therefore, the contactreliability between the second metal shield 64 and the first groundterminals G1 and the second ground terminals G2 is improved. In theillustrated embodiment of the present disclosure, a wall thickness ofthe third rib 6431, a wall thickness of the fourth rib 6432, and a wallthickness of a portion of the second main body portion 641 locatedbetween the third rib 6431 and the fourth rib 6432 are the same. In anembodiment of the present disclosure, soldering is performed on thesurfaces of the ribs 633 and the ribs 643 to solder the ribs 633 and theribs 643 to the first ground terminals G1 and the second groundterminals G2. For example, soldering is performed on the surfaces of thefirst ribs 6331, the second ribs 6332, the third ribs 6431 and thefourth ribs 6432 so that the first ribs 6331, the second ribs 6332, thethird ribs 6431 and the fourth ribs 6432 are soldered to the firstground terminals G1 and the second ground terminals G2. The solderingmethod is at least one of spot soldering, laser soldering and ultrasonicsoldering.

In addition, the second main body portion 641 further includes aplurality of second protruding pieces 6412 extending downwardly from abottom edge thereof, and a plurality of connecting pieces 6413 each ofwhich is located between two adjacent second protruding pieces 6412. Byproviding the second protruding pieces 6412, the shielding length can beextended, and the shielding effect on the signal terminals S1 can beimproved. In the illustrated embodiment of the present disclosure, theconnecting pieces 6413 is stamped from the second main body portion 641.The connecting piece 6413 straddles the corresponding slot 6231 toconnect the first end 6232 and the other side of the second end 6233 ofthe same first ground terminal G1 so as to improve the shielding effect.At the same time, the connecting piece 6413 can also connect the firstend portion 6232 and the other side of the second end portion 6233 ofthe same second ground terminal G2 so as to improve the shieldingeffect.

In the illustrated embodiment of the present disclosure, there aremultiple second extension portions 642 which are disposed at intervals.The fourth extensions 642 are used to be inserted into the first slots6612 and the second slots 6632 of the metal shell 66 so as to achievecontact and improve the shielding effect.

Referring to FIGS. 30 and 31 , in the length of the connection portion623 of the conductive terminal 62, the first rib 6331 of the first metalshield 63 and the third rib 6431 of the second metal shield 64 are incontact with two opposite side surfaces of the connection portion 623 ofthe first ground terminal G1, respectively. The second rib 6332 of thefirst metal shield 63 and the fourth rib 6432 of the second metal shield64 are in contact with two opposite side surfaces of the connectionportion 623 of the second ground terminal G2, respectively. As a result,a shielding cavity 67 surrounding the outer periphery of the connectionportion 623 of each pair of differential signal terminals is formed. Inthe illustrated embodiment of the present disclosure, the first rib 6331and the third rib 6431 contact the first wide surface 621 a of theconnection portion 623 of the first ground terminal G1, respectively.The second rib 6332 and the fourth rib 6432 contact the second widesurface 621 c of the connection portion 623 of the second groundterminal G2, respectively. In the illustrated embodiment of the presentdisclosure, the shielding cavity 67 is formed by the first main bodyportion 631, the second main body portion 641, the first ground terminalG1 and the second ground terminal G2. The connection portion 623 of thefirst ground terminal G1 includes a third tab portion 6234 extendinginto the shielding cavity 67. The connection portion 623 of the secondground terminal G2 includes a fourth tab portion 6235 extending into theshielding cavity 67. The connection portions 623 of the differentialsignal terminals are located between the third tab portion 6234 and thefourth tab portion 6235. In the illustrated embodiment of the presentdisclosure, there are a plurality of shielding cavities 67 which aredisposed along an arrangement direction of each group of the conductiveterminals 62. Two adjacent shielding cavities 67 share a single firstground terminal G1 or a single second ground terminal G2. Taking theshared first ground terminal G1 as an example, a part of the sharedfirst ground terminal G1 protrudes into one shielding cavity 67, andanother part of the shared first ground terminal G1 protrudes intoanother shielding cavity 67.

At a position adjacent to the contact portion 621 of the conductiveterminal 62, the first extension portion 632 and the second extensionportion 642 are both inserted into the first slot 6612 and the secondslot 6632 of the metal shell 66. The first extension piece 6611 and thesecond extension piece 6631 of the metal shell 66 are respectivelyinserted into the first notch 6216 of the first ground terminal G1 andthe second notch 6217 of the second ground terminal G2. At the sametime, the first elastic arm 634 of the first metal shield 63 and thethird elastic arm 644 of the second metal shield 64 clamp both sides ofthe contact portion 621 of the first ground terminal G1. The secondelastic arm 635 of the first metal shield 63 and the fourth elastic arm645 of the second metal shield 64 clamp both sides of the contactportion 621 of the second ground terminal G2. Specifically, the firstelastic arm 634 and the third elastic arm 644 clamp the first widesurface 621 a of the first ground terminal G1. The second elastic arm635 and the fourth elastic arm 645 clamp the second wide surface 621 cof the second ground terminal G2. With this arrangement, the first metalshield 63, the second metal shield 64, the metal shell 66, the firstground terminal G1, and the second ground terminal G2 are all connectedin series, thereby the shielding area is increased and the shieldingeffect is improved.

In the illustrated embodiment of the present disclosure, there aremultiple wafers 6 of the second backplane connector 200, and theterminal arrangement of two adjacent wafers 6 are staggered.Correspondingly, the shielding cavities 67 of two adjacent wafers 6 arealso staggered. When the wafer 6 is assembled to the header 5, the metalshell 66 of the wafer 6 passes through the corresponding terminalreceiving groove 511 so as to extend into the receiving space 535.

Referring to FIGS. 19 to 21 , the mounting block 8 includes a pluralityof first through holes 81 for allowing the tail portions 622 of thefirst ground terminals G1 to pass through, a plurality of second throughholes 82 for allowing the tail portions 622 of the second groundterminals G2 to pass through, and a plurality of slots 83 for allowingthe tail portions 622 of the signal terminals S1 to pass through. For agroup of conductive terminals 62 arranged in the manner of G1-S1-S1-G2,the first through hole 81 and the second through hole 82 are located onopposite sides of the slot 83 and are in communication with the slot 83.A width of the slot 83 is greater than a width of the first through hole81 and a width of the second through hole 82, so that the tail portions622 of the differential signal terminals can be completely exposed inthe slot 83. The mounting block 8 further includes a first abuttingsurface 831 located on one side of the slot 83 and a second abuttingsurface 832 located on the other side of the slot 83. The first abuttingsurface 831 and the second abutting surface 832 are disposed opposite toeach other. The first protruding piece 6312 of the first metal shield 63and the second protruding piece 6412 of the second metal shield 64 areat least partially inserted into the slots 83. In the illustratedembodiment of the present disclosure, the first protruding piece 6312 ofthe first metal shield 63 abuts against the first abutting surface 831.The second protruding piece 6412 of the second metal shield 64 abutsagainst the second abutting surface 832. Along an arrangement directionof the group of conductive terminals 62 arranged in the manner ofG1-S1-S1-G2, the tail portions 622 of the differential signal terminalsare located between the tail portion 622 of the first ground terminal G1and the tail portion 622 of the second ground terminal G2. Along thedirection perpendicular to the arrangement direction, the tail portions622 of the differential signal terminals are located between the firstprotruding piece 6312 of the first metal shield 63 and the secondprotruding piece 6412 of the second metal shield 64. This arrangementimproves the shielding effect of the differential signal terminals. Inan embodiment of the present disclosure, the mounting block 8 is made ofelectroplated plastic so as to further improve the shielding effect.

Referring to FIG. 21 , the mounting block 8 further includes a mountingwall 84 and a plurality of side walls 85 perpendicular to the mountingwall 84. The side walls 85 are spaced apart and parallel to each other,and a plurality of slots 80 for insertion of the wafers 6. Each slot 80is formed between two adjacent side walls 85. A top of the side wall 85includes an inclined surface 851 communicating with the slot 80 andacting as an insertion guide. The inclined surfaces 851 of the two sidewalls 85 located on opposite sides of the slot 80 have differentinclination directions so as to form a bell-mouth opening. Thebell-mouth opening is used to facilitate the insertion of the wafers 6or to facilitate to mount the mounting block 8 to the wafers 6. An innerside of the side wall 85 also includes a plurality of positioninggrooves 852 communicating with the slot 80 and used for positioning thefirst posts 6161 and the second posts 6162 which are located on thebottom wall 614 of the insulating frame 61.

The above embodiments are only used to illustrate the present disclosureand not to limit the technical solutions described in the presentdisclosure. The understanding of this specification should be based onthose skilled in the art. Descriptions of directions, although they havebeen described in detail in the above-mentioned embodiments of thepresent disclosure, those skilled in the art should understand thatmodifications or equivalent substitutions can still be made to theapplication, and all technical solutions and improvements that do notdepart from the spirit and scope of the application should be covered bythe claims of the application.

What is claimed is:
 1. A backplane connector, comprising a wafer and amounting block assembled with the wafer, the wafer comprising: aplurality of conductive terminals, each of the conductive terminalscomprising a contact portion, a tail portion and a connection portionconnecting the contact portion and the tail portion, the tail portionextending through the mounting block; an insulating frame fixed with theconnection portions of the conductive terminals, the contact portionsand the tail portions extending beyond the insulating frame; a firstmetal shield located on one side of the insulating frame; and a secondmetal shield located on the other side of the insulating frame; whereinthe conductive terminals comprise differential signal terminals, a firstground terminal and a second ground terminal, and the differentialsignal terminals are located between the first ground terminal and thesecond ground terminal; wherein the first metal shield comprises a firstprotruding piece, and the second metal shield comprises a secondprotruding piece opposite to the first protruding piece; wherein themounting block comprises a first through hole through which the tailportion of the first ground terminal extends, a second through holethrough which the tail portion of the second ground terminal extends,and a slot through which the tail portions of the differential signalterminals extend; and wherein the first protruding piece and the secondprotruding piece are at least partially inserted into the slot, and thetail portions of the differential signal terminals are located betweenthe first protruding piece and the second protruding piece.
 2. Thebackplane connector according to claim 1, wherein the mounting blockcomprises a first abutting surface located on one side of the slot and asecond abutting surface located on the other side of the slot; whereinthe first abutting surface and the second abutting surface are disposedopposite to each other; and wherein the first protruding piece abuts onthe first abutting surface, and the second protruding piece abuts on thesecond abutting surface.
 3. The backplane connector according to claim1, wherein the mounting block comprises a mounting wall and a pluralityof side walls perpendicular to the mounting wall; wherein the firstthrough hole, the second through hole and the slot extend through themounting wall; wherein the side walls are disposed at intervals andparallel to each other; and wherein an insertion slot for insertion ofthe wafer is formed between two adjacent side walls.
 4. The backplaneconnector according to claim 3, wherein a top portion of the side wallcomprises an inclined surface in communication with the insertion slot,and the inclined surface is adapted to guide the wafer to be insertedinto the insertion slot.
 5. The backplane connector according to claim3, wherein an inner side of the side wall further comprises a pluralityof positioning grooves communicating with the insertion slot; theinsulating frame comprises a bottom wall adjacent to the tail portions;the bottom wall comprises a first post and a second post protrudingoutwardly; and the first post and the second post are received in thepositioning grooves.
 6. The backplane connector according to claim 1,wherein the insulating frame defines a hollow portion; wherein theconnection portions of the differential signal terminals, the connectionportion of the first ground terminal and the connection portion of thesecond ground terminal are coplanar and are partially exposed to thehollow portion.
 7. The backplane connector according to claim 1, whereinthe first metal shield comprises a first main body portion, the firstmain body portion comprises a first rib protruding toward the firstground terminal and a second rib protruding toward the second groundterminal; wherein the second metal shield comprises a second main bodyportion, the second main body portion comprises a third rib protrudingtoward the first ground terminal and a fourth rib protruding toward thesecond ground terminal; and wherein the first rib and the third rib arein contact with opposite side surfaces of the connection portion of thefirst ground terminal, respectively; the second rib and the fourth ribare in contact with opposite side surfaces of the connection portion ofthe second ground terminal, respectively; and the first main bodyportion, the second main body portion, the first ground terminal and thesecond ground terminal jointly form a shielding cavity enclosing theconnection portions of the differential signal terminals.
 8. Thebackplane connector according to claim 7, wherein the connection portionof the first ground terminal comprises a first tab portion extendinginto the shielding cavity, the connection portion of the second groundterminal comprises a second tab portion extending into the shieldingcavity, and the connection portions of the differential signal terminalsare located between the first tab portion and the second tab portion. 9.The backplane connector according to claim 7, wherein the first metalshield comprises a first extension portion located on one side of thecontact portions of the conductive terminals, the first extensionportion comprises a first bulge protruding toward the first groundterminal and a second bulge protruding toward the second groundterminal; wherein the second metal shield comprises a second extensionportion located on the other side of the contact portions of theconductive terminals, the second extension portion comprises a thirdbulge protruding toward the first ground terminal and a fourth bulgeprotruding toward the second ground terminal; and wherein the firstbulge and the third bulge are in contact with opposite side surfaces ofthe contact portion of the first ground terminal, respectively; thesecond bulge and the fourth bulge are in contact with opposite sidesurfaces of the contact portion of the second ground terminal,respectively; and the first extension portion, the second extensionportion, the first ground terminal and the second ground terminaljointly form a shielding space enclosing the contact portions of thedifferential signal terminals.
 10. The backplane connector according toclaim 7, wherein the wafer comprises an insulating block sleeved on thecontact portions of the differential signal terminals, and a metal shellsleeved on the insulating block; and wherein the metal shell is incontact with the first metal shield and the second metal shield.